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The Process of Silicon Wafer Cleaning and Texturing

Cleaning Silicon Wafers

When silicon wafers are cut, they end up covered with cutting slurry, and the surface gets damaged by the cutting process. To address this, the wafers undergo a cleaning process involving a hot solution of sodium hydroxide. This solution effectively removes surface contamination and the first 10 µm of damaged silicon, preparing the wafers for further processing.

Texturing Silicon Wafers

After cleaning, silicon wafers are textured to enhance their performance. This texturing process typically involves immersing the wafers in a more dilute solution of sodium hydroxide with isopropanol as a wetting agent. For multicrystalline wafers, an acidic texturing method is often preferred. This method ensures a more uniform etch rate across grain boundaries, leading to improved overall quality.

Texturing is crucial as it helps reduce reflection and improve light absorption in solar cells, ultimately enhancing their efficiency.

Understanding the cleaning and texturing processes of silicon wafers is essential in the production of high-quality solar cells and other semiconductor devices. By following these meticulous steps, manufacturers can ensure that the wafers are free from contaminants and damage, leading to optimal performance in the final products.

Source: Intech Technologies